レーザーリフロー式チップ搭載装置 LAPLACEアプリケーション例

Cantilever (Vertical Chip Bonding)

Vertical Chip Bonding Example

Flip Chip Modules for contactless Smart Cards

Substrate handling: reel to reel
Assembly: Laplace soldering Flip chip attach

LCD Driver

Optoelectronic Applications

Fluxless laser soldering

Capacitor