レーザーリフロー式チップ搭載装置 LAPLACEアプリケーション例

Cantilever (Vertical Chip Bonding)



≧60um ピッチ



360°放射状の接合

Vertical Chip Bonding Example

Flip Chip Modules for contactless Smart Cards

Substrate handling: reel to reel
Assembly: Laplace soldering Flip chip attach

LCD Driver

Optoelectronic Applications

Fluxless laser soldering

Capacitor

Capacitor Attach on Flexible Circuit

お問い合わせ