Cantilever (Vertical Chip Bonding)
≧60um ピッチ
360°放射状の接合
レーザーリフロー式チップ搭載装置 LAPLACEアプリケーション例
Vertical Chip Bonding Example
Flip Chip Modules for contactless Smart Cards
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Substrate handling: reel to reel
Assembly: Laplace soldering Flip chip attach
LCD Driver
Optoelectronic Applications
Fluxless laser soldering
Capacitor
Capacitor Attach on Flexible Circuit
